TY  - JOUR
AB  - Mo/Si multilayers are fabricated by electron-beam evaporation in UHV at different temperatures (30° C, 150° C, 200° C) during deposition. After completion their thermal stability is tested by baking them at temperatures (T bak) between 200° C and 800° C in steps of 50° C or 100° C. After each baking step the multilayers are characterized by small angle CuK[Alpha]-X-ray diffraction. Additionally, the normal incidence soft-X-ray reflectivity for wavelengths between 11 nm and 19 nm is determined after baking at 500° C. Furthermore, the layer structure of the multilayers is investigated by means of Rutherford Backscattering Spectroscopy (RBS) and sputter/Auger Electron Spectroscopy (AES) technique. While the reflectivity turns out to be highest for a deposition temperature of 150° C, the thermal stability of the multilayer increases with deposition temperature. The multilayer deposited at 200° C stands even a 20 min 500° C baking without considerable changes in the reflectivity behaviour.
DA  - 1994
DO  - 10.1007/BF00323612
LA  - eng
IS  - 4
M2  - 371
PY  - 1994
SN  - 0721-7250
SP  - 371-376
T2  - Applied Physics A: Materials Science and Processing
TI  - Thermal stability of Mo/Si multilayer soft-X-ray mirrors fabricated by electron-beam evaporation
UR  - https://nbn-resolving.org/urn:nbn:de:0070-pub-17804301
Y2  - 2024-11-25T06:10:28
ER  -